Vacuum Reflow Solder System
The RSS-210-S Reflow Solder System is a very compact and easy useable tool for the use in laboratories and clean rooms as table top unit. The chamber is vacuum sealed and equipped with a viewing window. This allows the view control of the soldering process. The unit is standard equipped with a Mass Flow Controller for the process gas.
The heating plate is heated by infrared heater and has a heated area with 210 x 210 mm. It is made of aluminium. The excellent cooling rates are based on a water cooled chamber.
Requires water cooling.
The reflow solder system is perfect for the following applications:
flux-less soldering
flip chip process
adhesive bonding
solder bump reflowing
encapsulation of housings
soldering of power devices
heat treatment of semiconductor wafers
prototype development
quality control
Specification RSS-210-S (including options and accessories)
| Max. substrate size | 210 mm x 210 mm x 50 mm |
| Max. temperature | up to 400 °C, optionally up to 500 °C |
| T° continious | 400 °C |
| Ramp up rate | 180 K/Min. |
| Ramp down rate | up to 120 K/Min. |
| Substrate cooling | water cooled |
| Chamber cooling | water cooled channels |
| Vacuum | up to 10exp.-3 hPa, integrated pressure sensor |
| Flow meter | Mass Flow Controller for Nitrogen and other inert gases |
| Gases | Inert gases, other on request |
| Controller | SIMATIC© with 7" Touch Panel |
| Heating plate | Aluminium |
| Chamber height inside | 60mm, optionally 80 mm |
| Programs | 50 programs saveable |
| Formic acid module | 40ml vessel, to be filled manually |
| Hydrogen module | on request |
| USB Camera | Process viewing by USB camera system on top |
| Dimension | 430x295x290 mm |
| Weight | 23 kg |
| Power | 3 Phase, 230V, 50/60Hz or 100-115V or 200-208V |
