Rapid Thermal Vacuum Process Oven with ramp-up rate up to 150 K/sec.
Key features are
good temperature uniformity
precisely controlled ramp-up rates and fast ramp-down rates
low process turnaround
comfortable gas control
table top system with small foot print
Multipurpose table top unit with front loading drawer for the following applications:
excellent tool for various semiconductor processes
implementing of new semiconductor processes
prototype research
quality control
annealing
Rapid Thermal Processes
SiAu, SiAl, SiMo alloying
low k dielectrics
post implanting annealing
copper paste firing
resistor paste firing
other processes on demand
Technical Data:
for single wafer up to 100 mm (4") or 100 mm x 100 mm substrate size
process chamber made of quartz glass
with integrated gas in- and outlet
incl. one process gas line with Mass Flow Controller for Nitrogen (5 nlm = norm liter per min.)
heated by 18 infrared lamps (20 kW)
top and bottom heating (can be choosen)
vacuum capable for external pump system (up to 10E-3 hPa, for up to 10E-6 hPa: see RTP-100-HV)
SPS process controller with 50 programs and up to 50 steps each (ethernet interface), SIMATIC
7" touch panel for easy programming and process control
max. temperature 1200 °C
temperature control by thermocouple
water cooling required
electrical connection type: 32 A CEE plug (3x 230 V, 3 Phase, N, PE, 20 kW)
dimension oven: 504 x 504 (700) x 570 mm (w x d x h)
weight: 55 kg
The oven will be programmed by a Siemens SPS controller. This allows the storage of 50 programs with saving all temperature profiles and segments.
Options and accessories like water cooler, additional flow meters, additional gas lines, additional thermocouple etc. are available on request. This tool
is for various applications and customers. The small size allows comfortable loading and unloading of the chamber. The oven can be easily placed on
a standard laboratory table.
Options and accessories:
RTP-100 | Basic unit with 1 MFC for Nitrogen (5 nlm) |
RTP-MFC | Mass Flow controller (max. 4 in total) |
VAC I | Vacuum up to 3 hPa incl. Vacuum sensor and valve (excl. Pump) |
VAC II | Vacuum up to 10E-3 hPa incl. Vacuum sensor and valve (excl. Pump) |
MP | Membrane or diapgrahm pump |
RVP | Rotary vane pump |
RTP-Ox | Oxygen measurement |
RTP-MM | Moisture measurement |
RTP-H2+H2S | Hydrogen Module to use 100% Hydrogen with safety device incl. MFC |
RTP-SW | Switchbox for chiller and/or vacuum pump |
RTP-TC | Add. Thermocouple to measure on device (max. 1 pc) |
RTP-VCR | VCR connectors and lines (on request) |
WC III | Closed loop water cooling station |
RTP-GP | Graphite Plate or suzceptor (SiC coated: on request) |
RTP-PC-100 | additional oven chamber for usage with one process controller unit (double pack oven) 100 mm |
RTP-QR-50 | Adapter for 50 mm wafer |
RTP-QR-75 | Adapter for 75 mm wafer |