For Wire Bond Chip Packaging

The WB200 is a versatile and flexible tool and combines its excellent design functionality and flexibility.
• Include 2 arm goose neck LED light
• Include 60 mm Φ heated check/ height adjustable on request with microscope and vertical camera.
• Wedge, Ball and Bump Bonding
• 17um up to 50 um Gold- and Aluminium wire
• SPS Control with 7” Touch Panel
• Deep-access bond head
• Bondarm length: 165 mm
• 50 Prgrams saveable
• Mouse control X-Y and Z axis
• Motorized wire spool


Wedge Bonding
Ball Bonding