UNITEMP
MANUAL EPOXY DIE BONDER
For Small Chips and SMD Parts Assembly

UNITEMP Manual Epoxy Die Bonder/ Pick & Place System suitable for small chips and SMD parts assembly. It have the functions of:

  • Provide die assembly and small SMD placement platform
    • Prototyping inside laboratory (Lab, Jewellery, watches, SMD, BGA)
    • Capability to handle small parts.
    • Solder paste
    • High precise pick and place of very small and delicate devices
    • precisely design for gluing operation
    • Video interface compatible for Ultra-HD camera
    • provided side camera: can be tilted at any angle

Features
• Low picking force: less then 10g
• Adjustable bond force
• Rockign head, dispensing/ stamping
• Dimension: 270×5 500 x 352 mm
• Weight: 17 KG