UNITEMP
SOLDER REFLOW OVEN SYSTEM

RSS110
RSS160
RSS210S
RSO200
VSS450300
RSS110
RSS160
RSS210S
RSO200
VSS450300

UNITEMP provides a wide range of table-top solder reflow ovens for manual process in lab. The advance control on the heating ramp up rate in low pressure vacuum completely eliminate voids that result in the uniform process. These solder reflow ovens can be used for the following applications.

  • flux-less solder
  • flip chip development
  • adhesive bonding
  • solder bump reflow
  • power device soldering
  • annealing of semiconductor wafers
  • prototype development
MODEL RSS-110 RSS-160 RSS-210 -S RSO-200 VSS-450-300
Max subtract size 100x100mm 160x160mm 210x210mm 200x170mm 300x300mm
Tmax 400 C 400 C 400 C 650 C 400 C
T C Continuous at 400 C 400 C 400 C 650 C 400 C
Ramp up at 120K/min 100K/min 120K/min 120K/min 2K/sec
Vacuum up to 10-3hPa 10-3hPa 10-3hPa(*) 10-3hPa(*) 10-3hPa
Flowmeter MFC MFC MFC MFC MFC
Controller SIMATIC R SIMATIC R SIMATIC R SIMATIC R SIMATIC R
Dimension 260x450x220mm 300x420x220mm 643x480x310mm 504x504x570mm 504x504x680mm

(*) Optional up to 10-6hPa